¶ TPT HB16 Wire Bonder
| Location | Wire Bonder Lab (HL614) |
|---|---|
| Functions | Wedge wire bonding, optical microscope |
| Specimen | 4 inch wafer or smaller |
| Wire type | 25um wire, aluminium (1% silicon) and gold (on request) |
| Manufacturer | TPT |
| Responsible | Luc Wigbout |
Wire bonders literally bridge the gap from nano- and micro-structured patterns. to millimeter-sized devices, by allowing the user to weld a conductive wire between the two 'domains'. At its core, wire bonding is a form of solid-state welding—a process in which two materials are joined without melting, relying instead on pressure, friction, and sometimes heat to form a metallurgical bond.
The TPT HB16 Wire Bonder can provide wedge and ball bonding, and is mainly used for the prior. The system is equipped with an optical microscope and camera mount.